Basic Info.
Model NO.
Okey-am-088
Dielectric
FR-4
Base Material
Copper
Insulation Materials
Organic Resin
Processing Technology
Electrolytic Foil
Application
Consumer Electronics
Mechanical Rigid
Rigid
Material
Fr4
Color
Green, Blue, Black, Red, Yellow etc.
Transport Package
Inner Vacuum Packed Outside in Carton
Specification
UL ISO RoHS, REACH
Trademark
OKEY
Origin
Guangdong Shenzhen, China
HS Code
8534009000
Production Capacity
20 000 Square Meters Per Month
Product Description
| Technical Capabilities | |||
| Items | Speci. | Remark | |
| Max panel size | 32" x 20.5"(800mm x 520mm) | ||
| Max. Board size | 2000×610mm | ||
Min. board Thickness | 2-layer 0.15mm | ||
| 4-layer 0.4mm | |||
| 6-layer 0.6mm | |||
| 8-layer 1.5mm | |||
| 10-layer 1.6~2.0mm | |||
| Min. line Width/Space | 0.1mm(4mil) | ||
| Max. Copper thickness | 10OZ | ||
| Min. S/M Pitch | 0.1mm(4mil) | ||
| Min. hole size | 0.2mm(8mil) | ||
| Hole dia. Tolerance (PTH) | ±0.05mm(2mil) | ||
| Hole dia. Tolerance | ,+0/-0.05mm(2mil) | ||
| Hole position deviation | ±0.05mm(2mil) | ||
| Outline tolerance | ±0.10mm(4mil) | ||
| Twist & Bent | 0.75% | ||
| Insulation Resistance | >10 12 Ω Normal | ||
| Electric strength | >1.3kv/mm | ||
| S/M abrasion | >6H | ||
| Thermal stress | 288°C 10Sec | ||
| Test Voltage | 50-300V | ||
| Min. blind/buried via | 0.15mm (6mil) | ||
Surface Finished | HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold | ||
Materials | FR4,H- TG,Teflon,Rogers,Ceramics,Aluminium, Copper base | ||
| Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||
| Min PAD (inner layer) | 5 mil(0.13mm) | hole ring width | |
| Min thickness(inner layer) | 4 mil(0.1mm) | without copper | |
| Inner copper thickness | 1~4 oz | ||
| Outer copper thickness | 0.5~6 oz | ||
| Finished board thickness | 0.4-3.2 mm | ||
Board thickness tolerance control | ±0.10 mm | ±0.10 mm | 1~4 L |
| ±10% | ±10% | 6~8 L | |
| ±10% | ±10% | ≥10 L | |
| Inner layer treatment | brown oxidation | ||
| Layer count Capability | 1-30 LAYER | ||
| alignment between ML | ±2mil | ||
| Min drilling | 0.15 mm | ||
| Min finished hole | 0.1 mm | ||
Double sided pcb board with osp finish:
Place of Origin Guangdong, China (Mainland)
Brand Name OKEY
Model Number okey pcb
Base Material FR-4
Copper Thickness 1 OZ
Board Thickness 1.2 mm
Min. Hole Size 0.4mm
Min. Line Width 0.2mm
Min. Line Spacing 0.15mm
Surface Finishing HASL
Color red
Small order acceptable
Fire resistanceUL-94V0
Outline/contourmilling, V-cut, CNC Routing
100% productsE-test or flying probe test
Features
Thin board capabilities
Increase routing density in complicated desig
Excellent mounting stability and reliability
Qualified material and surface treatment for Lead-free process
Applications
Smartphone, Feature Phone, Tablet, Ultrabook, e-Reader, MP3 Player, GPS, Portable Game Console, DSC, Camcorder, LCD Module
Benefits
Well experienced manufacturer with good yiel
Multiple plants increase production output in short time
| NO | Item | Technical capabilities |
| 1 | Layers | 1-20 layers |
| 2 | Max. Board size | 2000×610mm |
| 3 | Min. board Thickness | 2-layer 0.15mm |
| 4-layer 0.4mm | ||
| 6-layer 0.6mm | ||
| 8-layer 1.5mm | ||
| 10-layer 1.6~2.0mm | ||
| 4 | Min. line Width/Space | 0.1mm(4mil) |
| 5 | Max. Copper thickness | 10OZ |
| 6 | Min. S/M Pitch | 0.1mm(4mil) |
| 7 | Min. hole size | 0.2mm(8mil) |
| 8 | Hole dia. Tolerance (PTH) | ±0.05mm(2mil) |
| 9 | Hole dia. Tolerance (NPTH) | +0/-0.05mm(2mil) |
| 10 | Hole position deviation | ±0.05mm(2mil) |
| 11 | Outline tolerance | ±0.10mm(4mil) |
| 12 | Twist & Bent | 0.75% |
| 13 | Insulation Resistance | >10 12 Ω Normal |
| 14 | Electric strength | >1.3kv/mm |
| 15 | S/M abrasion | >6H |
| 16 | Thermal stress | 288°C 10Sec |
| 17 | Test Voltage | 50-300V |
| 18 | Min. blind/buried via | 0.15mm (6mil) |
| 19 | Surface Finished | HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
| 20 | Materials | FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |